Product introduction
Product Overview

EMWave is a fully integrated, power integrity (PI) and signal integrity (SI) analysis tool for electronic packaging and printed circuit board (PCB) design. By the means of three-dimensional (3-D) modeling and finite-element method (FEM) analysis, EMWave can perform 3-D, full-wave model extraction and power and signal integrity analysis, which includes DC (static), AC (frequency domain) and transient (dynamic) analysis.

By using EMWave to import the physical database of a design from various CAD tools , display the imported layout graphically and list its material parameters, the designer can modify the package/PCB design. EMWave discretizes the 3-D physical model and then solves Maxwell’s equations to extract resistive SPICE models or broadband S-parameters from the discretized geometries by FEM method.

 
Main Functions

3-D, full-wave network extraction, power and signal integrity analysis

IC/package/PCB co-analysis with seamless integration of Chip Power Model (CPM) and other sub-circuit based models

Built-in S parameter post-process tool

DC (static IR-drop), AC and transient (dynamic IR-drop) analysis

Fitted circuit model conversion from S-parameters

Current density, resistance check, impedance analysis

 
Supported Design Input

Cadence APD, SiP, Allegro

Zuken RIF, CR-5000

AutoCAD DXF

Mentor Graphics Board Station, PADS, Expedition

Mentor ODB++  

Leadframe

 
Outputs

Touchstone S, Y, Z parameters

Static IR-drop analysis map

Resistance SPICE model

Current density map

Time-domain dynamic voltage-drop analysis

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