EMWave is a fully integrated, power integrity (PI) and signal integrity (SI) analysis tool for electronic packaging and printed circuit board (PCB) design. By the means of three-dimensional (3-D) modeling and finite-element method (FEM) analysis, EMWave can perform 3-D, full-wave model extraction and power and signal integrity analysis, which includes DC (static), AC (frequency domain) and transient (dynamic) analysis.
By using EMWave to import the physical database of a design from various CAD tools , display the imported layout graphically and list its material parameters, the designer can modify the package/PCB design. EMWave discretizes the 3-D physical model and then solves Maxwell’s equations to extract resistive SPICE models or broadband S-parameters from the discretized geometries by FEM method.
3-D, full-wave network extraction, power and signal integrity analysis
IC/package/PCB co-analysis with seamless integration of Chip Power Model (CPM) and other sub-circuit based models
Built-in S parameter post-process tool
DC (static IR-drop), AC and transient (dynamic IR-drop) analysis
Fitted circuit model conversion from S-parameters
Current density, resistance check, impedance analysis
Cadence APD, SiP, Allegro
Zuken RIF, CR-5000
AutoCAD DXF
Mentor Graphics Board Station, PADS, Expedition
Mentor ODB++
Leadframe
Touchstone S, Y, Z parameters
Static IR-drop analysis map
Resistance SPICE model
Current density map
Time-domain dynamic voltage-drop analysis