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2025.10.16Julin Technology Wins "Technology Innovation Award" at WESEMIBAY 2025Julin Technology Wins "Technology Innovation Award" at WESEMIBAY 2025
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2025.09.26JULIN Honored as "2025 Most Promising Enterprise" by EY FudanJULIN has been honoured as one of the ‘Most Promising Enterprises for 2025’ by Ernst & Young and Fudan University.
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2025.07.24JULIN wins “Ecological Contribution Award”Read More -
2025.04.09Julin: Never Thought of Domestic Substitution, but Julin's Chiplet Package Design SI Simulation Products Reach Industry Leadership LevelsJulin: Never Thought of Domestic Substitution, but Julin's Chiplet Package Design SI Simulation Products Reach Industry Leadership Levels
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2025.03.26Julin Technology Wins“Quality Enterprise of Semiconductor EDA Market Development”and Promoting industrial ecosystem upgrades through independent innovation.Julin Technology Wins“Quality Enterprise of Semiconductor EDA Market Development”and Promoting industrial ecosystem upgrades through independent innovation.
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2025.03.10Julin Technology Wins 2024 Shenzhen IC Industry"Innovative Chip Rising Star Award"!Read More
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Julin Technology Wins "Technology Innovation Award" at WESEMIBAY 20252025.10.16 -
JULIN Honored as "2025 Most Promising Enterprise" by EY Fudan2025.09.26 -
JULIN wins “Ecological Contribution Award”2025.07.24 -
Julin: Never Thought of Domestic Substitution, but Julin's Chiplet Package Design SI Simulation Products Reach Industry Leadership Levels2025.04.09 -
CEO Interview: Jumping out of the framework of domestic substitution, defining the future of EDA with products2025.04.01 -
Julin Technology Shines at IIC Shanghai 2025: Shares Chiplet Technology Insight, Wins EDA Technology Breakthrough of the Year Award!2025.04.01 -
Julin Technology Wins“Quality Enterprise of Semiconductor EDA Market Development”and Promoting industrial ecosystem upgrades through independent innovation.2025.03.26 -
Julin Technology Wins 2024 Shenzhen IC Industry"Innovative Chip Rising Star Award"!2025.03.10 -
Southeast University and Julin Technology collaborated to publish an article on IEEE Xplore2024.06.25