Julin: Never Thought of Domestic Substitution, but Julin's Chiplet Package Design SI Simulation Products Reach Industry Leadership Levels

Recently, Mr. Sun Jiaxin, Founder and Chairman of Julin Technology, was invited to be interviewed by ASPENCORE. During the interview, Mr. Sun said that the chiplet package design SI simulation products developed by Julin Technology have reached a “industry-leading” position, which is also ahead of the international competitors, and has been recognized by the head enterprises. (Source: Electronic Engineering Album video)