Julin Technology Shines at IIC Shanghai 2025: Shares Chiplet Technology Insight, Wins EDA Technology Breakthrough of the Year Award!

On March 27, the highly anticipated International Integrated Circuit Exhibition and Symposium (IIC Shanghai 2025) officially opened in Shanghai, drawing significant attention from the global semiconductor industry.

Technical Presentation:

During the Chiplet and Advanced Packaging Technology Forum on March 27, Mr. Qian Beijie, head of the R&D and AE at Julin Technology, delivered an in-depth technical analysis titled "Challenges and Responses in Signal Integrity (SI) for Chiplet Packaging Design" to an audience of over a hundred professionals.

Award News：

During the conference, the "2025 China IC Leaders Summit and China IC Design Achievement Award Ceremony" took place, where Julin Technology emerged victorious among numerous outstanding contenders, Winning the "Annual Technical Breakthrough EDA Company" Award.

Awarding Organization：AspenCore is a leading global media organization in the electronic engineering field, encompassing websites, magazines, and platforms such as EETimes, Electronic Engineering Times, EDN, Electronic Design, International Electronics, and the Breadboard Community, along with a vast user database. With its rich media resources and a professional industry analyst team, AspenCore provides extensive industry influence and authority for the selection of the China IC Design Achievement Award.