Julin Technology Shines at ICDIA , Demonstrates Technology Leadership

Ⅰ. Event Background  

Recently, the 5th ICDIA was successfully held in Suzhou for two days!

As a key EDA provider in China, Julin Technology was invited to attend the conference and actively participated in technical sharing, achievement showcases, and ecosystem exchanges.  

Ⅱ. Technical Presentations  

Julin Technology delivered two technical speeches at the conference, addressing core industry pain points and challenges while presenting innovative solutions and demonstrating technological leadership.  

1. Summit Forum  

On the morning of the 11th, Mr.Jiaxin Sun , CEO of Julin Technology, delivered a keynote speech titled "Julin's Unified CPS Sign-Off Simulation Solution" at the Summit Forum, proposed an innovative approach to current chip industry challenges.  

Mr.Sun highlighted the soaring complexity of chips, the widespread adoption of high-speed interfaces, and the growing challenges of system integration. He emphasized that traditional point-tool simulations can no longer meet the demands of collaborative design and precise sign-off across chip dies, package interconnects, and system board levels.  

To address these challenges, Mr. Sun systematically introduced Julin Technology’s "Unified CPS (Chip-Package-System) Sign-Off Simulation Solution." By integrated multi-stage toolchains, the solution provides a one-stop , high-precision, and high-efficiency simulation and verification platform , helping customers accelerate R&D iterations, reduce costs, and shorten design and verification cycles.  

Mr. Sun stressed that simulation accuracy is Julin Technology’s relentless pursuit. The core engine of its products has undergone six years of collaboration with leading enterprises,  Huawei, achieving precision that meets industry standards and even surpasses overseas competitors.

2. IC Design & Innovation Application Forum  

On the morning of the 12th, Dr. Junyong Deng, Deputy GM of Julin Technology, delivered an in-depth presentation titled "one-stop high-speed simulation platform empowers advanced packaging design" at the IC Design & Innovation Application Forum.  

Dr. Deng pointed out that advanced packaging design has become a core development direction in the semiconductor industry, especially amid the China-U.S. trade tensions, which present opportunities for domestic EDA tools to break through. He systematically analyzed four major technical challenges in advanced packaging: mechanical warping, power consumption and thermal dissipation, signal integrity, and power integrity.  

In response, Dr. Deng introduced Julin Technology’s independently developed one-stop high-speed simulation platform. Centered on its Golden-level accuracy TRUE-SPICE (TJSPICE) engine, the platform integrates multiple technical modules to provide Unified SI/PI simulation, PCB full-board simulation, and power electronics simulation. The platform’s products have already been adopted as sign-off standards by leading enterprises.  

Regarding the breakthrough of domestic EDA, Dr. Deng advised against overambitious expansion, advocating instead for a "small but specialized, small but refined" strategy —  deepening technological expertise, connecting the dots, and building a comprehensive high-speed design verification ecosystem.  

Both speeches garnered widespread industry attention, with lively discussions among attendees on technical details and application scenarios, further showcasing Julin Technology’s forward-thinking leadership in the EDA field.  

III. Booth Engagement – Where Technical Prowess Meets Ecosystem Appeal  

During the conference, Julin Technology’s modern and minimalist booth became a focal point at the exhibition. Through three core sections, the booth showcased the company’s technical capabilities and ecosystem achievements, drawing significant industry interest.  

1. Core Technologies & Product Matrix: Full-Link Simulation Solutions Driving Industrial Upgrades  

-SIDesigner: A unified system-level SI/PI simulation platform with built-in Golden-accurate SPICE engine.

-HobbSim: A batch time-domain signal integrity simulation platform for complete PCB analysis, benchmarking against industry-leading solutions.

-PowerExpert: Mixed-signal power electronics system design and simulation tool with Golden-level precision.

2. Brand Image & Technical Strength: A Dual Driving Force  

   The booth combined dynamic visuals with static displays to convey corporate value. A loop corporate video vividly illustrated Julin Technology’s EDA expertise and innovation journey, while well-designed panels clearly presented the company’s profile, milestones, culture, and vision, leaving a lasting impression.  

3. Immersive Interaction: Technical Q&A & Ecosystem Collaboration  

   The booth featured demo videos showcase tool applications and performance advantages, attracte numerous visitors. On-site technicians engaged in in-depth discussions on technical challenges, provided tailored solutions, and explored collaboration models, paving the way for future innovation. Additionally, fun interactive activities—such as mini-games with prizes like automatic umbrellas and neck pillows—helped build connections, with multiple industry professionals express interest in collaboration.  

IV. Refreshing Tea Break – Julin Technology Empowers the Event with Thoughtful Hospitality  

Amid the scorching summer heat, Julin Technology set up an elegant tea break area in the exhibition hall, injecting a refreshing vitality into the event with meticulous care. Chilled beverages, fresh seasonal fruits, artisanal pastries, and freshly brewed jasmine tea not only provided respite from the heat but also served as an energy boost during intellectual exchanges.  

V. Conclusion: Steering with Technology, Pioneering a New Ecosystem   

At this year’s ICDIA, Julin Technology showcased the innovative vitality and responsibility of domestic EDA enterprises through technical presentations and achievement displays. Moving forward, Julin Technology will continue to deepen its expertise in chip simulation and verification, empowering industrial upgrades with self-developed toolchains and collaborating with partners to build an open, win-win domestic chip ecosystem.  

Special Thanks: We extend our gratitude to the conference organizers and all attendees! Julin Technology looks forward to reuniting with you at the next industry event!