Julin Technology Showcases Unified CPS SI/PI Simulation Platform at ICCAD

Event Background:

On November 21, the 2025 Integrated Circuit Development Forum (Chengdu-Chongqing) and the 31st Integrated Circuit Design Exhibition (ICCAD 2025) successfully concluded at the China Western International Expo City in Chengdu. As a leading domestic provider of EDA simulation and sign-off solutions, Julin Technology was invited to attend this major industry event. Julin showcased its unified chip-package-system (CPS) sign-off simulation solution and delivered keynote speeches at the summit forum and multiple technical forums. Focusing on hot topics such as sign-off design for advanced packaging and breakthroughs in SI simulation technology, Julin engaged with industry leaders, enterprise representatives, experts, and scholars to discuss new trends in IC design and simulation.

Technical Presentations：

At the opening day's summit forum of ICCAD 2025, Jiaxin Sun, Chairman of Julin Technology, delivered a speech titled Sign-Off Design with SIDesigner. Addressing the complex requirements of cross-domain (electromagnetic + circuit + system) simulation, he systematically elaborated on Julin Technology's strategic thinking and practical approach in the fields of SI and PI (Signal Integrity/Power Integrity). He particularly introduced Julin's unified system-level SI/PI simulation platform, SIDesigner, which aims to ensure signal and power integrity at the source of high-speed, high-density designs.

At the special forum on "EDA and IC Design Services," Dr. Junyong Deng, Vice President of Julin Technology, presented a speech titled The Path to Breakthrough for Domestic SI Simulation Tools. He pointed out that, facing the long-term accumulated technological, market, ecosystem, and talent advantages of internationally renowned EDA companies, it is extremely challenging for domestic EDA tools—even point tools—to achieve breakthroughs, requiring a long-term commitment. Starting from the fundamental logic of EDA tools and focusing on signal integrity (SI) simulation tools, combined with Julin Technology's in-depth research in this field, the speech explored the breakthrough paths for domestic SI simulation tools and shared practical case studies of Julin's SIDesigner in customer applications.

At the "Advanced Packaging and Testing" forum, Dr. Beijie Qian, R&D Director of Julin Technology, delivered a presentation titled Advanced Packaging Signoff: A Unified System-Level SI/PI Simulation Platform. He highlighted three major challenges faced by advanced packaging simulation tools: modeling accuracy of high-speed signals in complex interconnect structures; design difficulties of power delivery networks under multi-physics coupling; and workflow integration and data interaction issues in chip-package-PCB co-simulation. In response to the unique challenges of advanced packaging, he introduced Julin Technology's advanced packaging sign-off solution and its unified CPS SI/PI simulation platform.

Exhibition Booth and Refreshment Breaks：

At the exhibition, Julin Technology comprehensively demonstrated its latest R&D achievements and practical application cases across its three core business areas: the unified system-level SI/PI simulation platform, the PCB/PKG electromagnetic field modeling platform, and the power electronics simulation platform. The booth also featured live technical demonstrations, expert Q&A sessions, and interactive lucky draw activities, attracting numerous professional visitors for in-depth discussions and hands-on experiences.

During the event, Julin Technology provided refreshments and desserts for attendees, adding moments of relaxation to the intensive technical exchanges.

Looking Ahead：

Looking ahead, Julin remains committed to its mission of “Simulate a Better Future,” with continued advancements in both circuit and electromagnetic simulation. We will continue to focus on cutting-edge industry needs, deepen collaboration with strategic partners, and introduce new benchmark-setting products. Through sustained technological iteration and ecosystem development, we will connect breakthroughs into integrated solutions and expand them into platform-level capabilities—building world-class EDA solutions from China and contributing to the nation’s rise as a global leader in the EDA industry.